Odisha’s Hi-Tech Foray, To Set Up Rs 1900-Crore Semiconductor Plant

Odisha which has strong presence in metals and mining is now entering the high the hi-tech semiconductor arena. In a major development, the Union IT Minister Ashwini Vaishnav laid the foundation stone for India’s first silicon-semiconductor plant in Odisha which will make India’s first 3D chip packaging unit at Infovalley-II in Bhubaneswar. It is indeed a historic day for Odisha. This import substitute project worth Rs 1,943 crore is being developed by 3D Glass Solutions Inc (3 DGS) with the Central government investing Rs 799 crore and Odisha government Rs 399.5 crore. This facility is targeting to produce 70,000 glass panels annually, 50 million assembled units and 13,000 advanced 3D heterogeneous integration modules. Sources say, commercial production is slated to begin by August 2028 with the plant going full stream by 2030. The challenges for 3DGS henceforth are cut out for meeting Odisha’s requirement. It needs to make the chip work faster to meet massive computational demand of AI, improving energy efficiency, saving energy, reducing signal losses and handling high temperature issues. Additional Chief Secretary of Odisha’s Energy Department Vishal Kumar Dev called the project “a watershed moment of the state”. He said 3DGS, the company behind this project, is a globally recognised player backed by giants like Intel and Lockheed Martin.